BREAKING APPARATUS OF BRITTLE MATERIAL SUBSTRATE

Title:

BREAKING APPARATUS OF BRITTLE MATERIAL SUBSTRATE

Document Type and Number:

Japanese Patent JP2016064669

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a breaking apparatus of a brittle material substrate and a breaking method of the brittle material substrate, capable of reducing a cost of an adhesive film by enabling break of a substrate without using the adhesive film.SOLUTION: A substrate 100 is sucked and held on an elastic sheet member 101 by exhausting between the substrate 100 and the elastic sheet member 101 through a suction groove 72 and a suction port 71 by action of an exhaust part 74. When the substrate 100 is pressed by a break bar 14 in this state, bending stress is generated in the substrate 100 by elastic force of the elastic sheet member 101, thereby breaking the substrate 100 at a position corresponding to a scribe line 99.SELECTED DRAWING: Figure 3

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