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Patent Searching and Data


Title:
BUFFER MATERIAL FOR ASSEMBLY PACKAGING
Document Type and Number:
Japanese Patent JPH08104368
Kind Code:
A
Abstract:

PURPOSE: To prevent deformation and damage to an item by storing the item obliquely with respect to the side surface of a buffer material and forming a recessed groove in the side wall of a frame body so that impact forces acting on the item at the time of sideward falling can be dispersed.

CONSTITUTION: In a frame body 3 formed by two sets of side walls 4, 4 and 9, 9 composed of an expanded synthetic resin, a plurality of storage spaces 8 for receiving box-shaped or board-shaped items are parallelly located along the length direction of a set of the side walls 4, 4 so as to be inclined with respect to the outer surface of the wall 9, as seen in a plan. A recessed groove 12 is vertically formed in each of the spaces 8, in the inner surface of the walls 4, 4, in which a plurality of spaces 8 are arranged, thereby forming a buffer material 1 for assembly packaging. As a result, when an impact acts on the side surface of the frame body at the time of sideward falling thereof, the whole frame body 3 is deformed due to the recessed grooves 12 into an accordion form so that the impact is uniformly distributed in the spaces, protecting thereby the item stored in each of the spaces 8.


Inventors:
WATANABE KAZUYOSHI
KOMATA EIICHI
Application Number:
JP24108094A
Publication Date:
April 23, 1996
Filing Date:
October 05, 1994
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
II P I KK
International Classes:
B65D5/50; B65D81/113; (IPC1-7): B65D81/113; B65D5/50
Attorney, Agent or Firm:
柳野 隆生