Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BUILT-IN RESISTANCE FOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH03101262
Kind Code:
A
Abstract:

PURPOSE: To simplify a process by superposing an insulating film and a polycrystalline silicon film on a semiconductor region and by carrying out ion implantation of impurity of reverse conductivity type to that of a semiconductor region at an accelerating voltage which allows impurity to attain to the inside of a semiconductor region below the polycrystalline silicon film from the polycrystalline silicon film side.

CONSTITUTION: A thick oxide film 2 and a thin oxide film of an insulating film 3 are formed on a surface of a semiconductor region 1. After a polycrystalline silicon film 4 is formed all over the thick oxide film 2 and the insulating film 3, both edge parts of a pattern of the insulating film 3 are exposed by photoetching, and formed to a rectangular pattern whose upper and lower side parts remain on the thick oxide film 2. Then, boron is ion-implanted to the polycrystalline silicon film 4 and the semiconductor region 1 below the insulating film 3 using the thick oxide film as a mask; an boron injection amount is shared between the polycrystalline silicon film 4 and the semiconductor region 1 at a ratio of about 7:3. Then, a pair of a resistance connecting layer 5 and a resistance layer 6 are built by thermally diffusing impurity by applying heat treatment at a high temperature. After a layer insulating film 9 is applied all over, a window is shaped and electrode films 11, 12 and electrode film 13, 14 are provided by a metallic film. Thereby, a chip size can be reduced.


Inventors:
TADA HAJIME
Application Number:
JP1989000238691
Publication Date:
April 26, 1991
Filing Date:
September 14, 1989
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L27/04; H01L21/822; (IPC1-7): H01L27/04
Domestic Patent References:
JPS62234363A1987-10-14
JPS6370552A1988-03-30
JPS63244764A1988-10-12