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Title:
CERAMIC BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3916136
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a ceramic board having a snap line which has no crack in a baking step or a working step halfway and a normal crack in final breaking work, and to provide a method for manufacturing the same.
SOLUTION: The ceramic board 10 comprises longitudinal and/or lateral snap lines 16 for dividing the first main surface 12 and/or the second main surface 13 of a sintered material having through holes 11 into a plurality of ceramic circuit boards 15 across the holes 11 as planely seen so that a part or all of the lines 16 are made of discontinuous linear breaking grooves 17 as planely seen, a part having no groove 17, the groove 17 of the line 16 provided across the hole 11 is connected to a ridge line of the opening of the hole 11 at the peripheral edge of the hole 11, and having a part including the groove 17 and a part not including the groove 17 except the peripheral edge.


Inventors:
岡藤 英雄
池田 拓児
西川 勝裕
Application Number:
JP2002000067610
Publication Date:
May 16, 2007
Filing Date:
March 12, 2002
Export Citation:
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Assignee:
株式会社住友金属エレクトロデバイス
International Classes:
B28B11/12; H01L23/12; H05K1/02; H05K3/00; (IPC1-7): H01L23/12; B28B11/12; H05K1/02; H05K3/00
Domestic Patent References:
JP6087085A
JP62151749U
Attorney, Agent or Firm:
中村 照雄