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Title:
CERAMIC BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP2734404
Kind Code:
B2
Abstract:

PURPOSE: To restrain the surface of a through-hole from becoming higher than that of a wiring board due to a thermal treatment carried out for the formation of an insulating layer by a method wherein a through-hole is provided on the board so as to penetrate through it zigzagging a few time.
CONSTITUTION: A through-hole 36 is provided on a ceramic board 35 zigzagging so as to be connected to a power supply wiring layer 34 inside the board 35. An organic resin insulating layer is formed of polyimide resin, and a thermal expansion coefficient difference between an alloy provided inside a through-hole and a ceramic board is represented by a formula, (19.1-4.2)×10-6[1/°C]×(400-20) [°C]×5.5[mm]=31.1×10-3[mm], when the ceramic board 35 is heated up to a temperature of 400°C. Supposing that the through-hole protrudes from both the sides of the board conforming to the above formula, the through-hole protrudes as long as 15.6μm or so. When a through-hole is provided zigzagging once at a point 1mm inside the rear of the board, the through-hole protrudes 25μm or so. The more times a through-hole is provided zigzagging, the shorter the through-hole becomes, so that the surface of the through-hole is restrained from becoming higher than that of the board.


Inventors:
OKADA KEIICHI
Application Number:
JP12518195A
Publication Date:
March 30, 1998
Filing Date:
May 24, 1995
Export Citation:
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Assignee:
NIPPON DENKI KK
International Classes:
H05K3/46; H05K1/00; H05K1/03; H05K3/40; (IPC1-7): H05K3/46
Domestic Patent References:
JP2271596A
JP4978166A
JP62172794A
JP61108192A
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)



 
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