Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CERAMIC BOARD FOR THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
Japanese Patent JP3798973
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To efficiently transmit the heat of a heater such as an optical semiconductor element or the like to the exterior by not concentrating a thermal stress generated by a thermal expansion difference between the ceramic board and an electrode and a thermal stress generated by the thermal expansion difference between the electrode and a thermoelectric element at the junction of the electrode and the board.
SOLUTION: The ceramic board for the thermoelectric conversion module comprises a copper layer 2b laminated on a metallized layer 2a on one main surface of the ceramic board 1, a plurality of the electrodes 2 consisting of 2a and 2b and having the thermoelectric element 3 fixedly mounted on the upper surface and independently formed. In this board, the electrodes 2 are formed with skirt parts 4 made of recessed curved surface over the entire periphery of the outer peripheral end of the metallized layer 2a, and the board 1 is formed with a skirt extended part 5 having a recessed curved surface continued from the peripheries of the electrodes 2 of the main surface to the skirt parts 4.


Inventors:
形部 浩介
Application Number:
JP2001000363239
Publication Date:
July 19, 2006
Filing Date:
November 28, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
京セラ株式会社
International Classes:
H01L23/12; H01L35/32; H01L23/38; H01L23/40; H01L35/08; H01S5/024; (IPC1-7): H01L35/32; H01L23/12; H01L23/38; H01L23/40; H01L35/08; H01S5/024
Domestic Patent References:
JP63020465U
JP10093149A
JP64008764U
JP7273149A
JP1205590A
JP6077340A