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Patent Searching and Data


Title:
CHAMFERING SYSTEM AND TRUING DEVICE USED THEREFOR
Document Type and Number:
Japanese Patent JP2019166624
Kind Code:
A
Abstract:
To make it possible that even when the machining conditions are different among each of wafer chamfering machines, shape accuracy of machined wafer end faces are made to fall within a predetermined range to keep uniform quality and maintain high productivity.SOLUTION: A chamfering system includes: a wafer chamfering line 1 having a plurality of wafer chamfering machines 10 installed thereon; a wafer shape measurement machine 2 measuring an end face shape of a wafer W machined by the respective wafer chamfering machines 10; a controller 3-1 determining whether or not to adjust a grindstone 55 from values measured by the wafer shape measurement machine 2; and a grinding machine 3-2 including a master grindstone 142 provided with a plurality of master grooves 143-1 to enable the master grooves 143-1 to form grinding grooves in the grindstone 55. The controller 3-1 selects one from among the plurality of master grooves 143-1 on the basis of the values measured by the wafer shape measurement machine 2. The grinding machine 3-2 uses the selected master groove 143-1 to form a grinding groove.SELECTED DRAWING: Figure 1

Inventors:
KISHISHITA SHINICHI
KO KAKYOKU
Application Number:
JP2018058564A
Publication Date:
October 03, 2019
Filing Date:
March 26, 2018
Export Citation:
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Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24B49/18; B24B9/00; B24B53/00; H01L21/304
Domestic Patent References:
JP2004243422A2004-09-02
JP2005153085A2005-06-16
Attorney, Agent or Firm:
Yoshinobu Kanayama