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Title:
CHARGED PARTICLE BEAM APPARATUS
Document Type and Number:
Japanese Patent JP2010102984
Kind Code:
A
Abstract:

To provide a charged particle beam apparatus improved in inspection accuracy corresponding to the pattern refining of an inspection object while being compact and reduced in cost.

The inspection position (a wafer coordinate system) of an inspected sample is converted into an arranged position (a stage coordinate system (a polar coordinate system)) of an inspection mechanism. A rotating arm 102 is rotated, and a rotary stage 103 is rotated to move the inspection position of the inspected sample into the arranged position of the inspection mechanism. At this time, the deviation amount or the like of the center of the rotary stage 103 can be computed and corrected. The inspection accuracy can thereby be improved corresponding to the pattern refining of the inspected object in the charged particle beam apparatus having a biaxial rotary stage mechanism. Further, since a plurality of inspection devices are arranged on a moving locus of the center of the rotary stage 103 described by the rotation of the rotating arm 102, the charged particle beam apparatus capable of making multiple kinds of inspection while being compact can be achieved.


Inventors:
YANO MANABU
ITO HIROYUKI
ISHII RYOICHI
OTAKA TADASHI
KAWANO HAJIME
Application Number:
JP2008000273986
Publication Date:
May 06, 2010
Filing Date:
October 24, 2008
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP
International Classes:
H01J37/20; H01L21/66
Domestic Patent References:
JP2007059640A2007-03-08
JP2000207028A2000-07-28
JP2008024457A2008-02-07
JP2008305905A2008-12-18
JP3389788B22003-03-24
JPH08162057A1996-06-21
JP2007059640A2007-03-08
JP2000207028A2000-07-28
JP2008024457A2008-02-07
JP2008305905A2008-12-18
JP3389788B22003-03-24
Attorney, Agent or Firm:
春日 讓



 
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