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Title:
【発明の名称】チップ化モジュール
Document Type and Number:
Japanese Patent JP2609634
Kind Code:
B2
Inventors:
Isao Izumi
Application Number:
JP25587687A
Publication Date:
May 14, 1997
Filing Date:
October 08, 1987
Export Citation:
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Assignee:
NEC
International Classes:
H01L23/02; H01L21/338; H01L23/04; H01L23/12; H01L29/80; H01L29/812; H01P3/08; H01P5/02; H01P5/08; H01P5/10; H03F3/60; (IPC1-7): H01P5/08; H01L23/04; H01L23/12; H01P3/08; H03F3/60
Domestic Patent References:
JP55128901A
JP5991717A
JP59107601A
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)



 
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