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Patent Searching and Data


Title:
CIRCUIT BOARD PASTE AND MANUFACTURE OF MULTI-LAYER CERAMIC CIRCUIT BOARD EMPLOYING THE PASTE
Document Type and Number:
Japanese Patent JPH02122698
Kind Code:
A
Abstract:

PURPOSE: To obtain an inexpensive multi-layer ceramic circuit board having stable conductivity and causing scarce oxidizing degradation by containing specific amount of metal compound of specific composition containing Ni, Pd, Ag and glass powder composed of SiO2, B2O3, Al2O3, CaO, MgO.

CONSTITUTION: 30-100wt.% nickle, 0-30wt.% paradium and 0-60wt.% silver are contained. When the weight ratio between respective components is shown by a triangular diagram, such metal powder or metal powder mixture as the content of metal(Ni:Pd:Ag) is contained in a polygonal region defined by connecting apices(A, B, C, D, E) is employed; where A=100:0:0, B=70:30:0, C=30:30:40, D=40:10:50, E=80:0:20. Furthermore, glass powder composed of 50-70wt.% SiO2, 8-13wt.% B2O3, 5-15wt.% Al2O3, 5-20wt.% CaO and 0-5wt.% MgO is contained by 5-20wt.% for 100wt.% of the metal powder mixture.


Inventors:
MIZUNO TORU
SAEKI KYOJI
TAGUCHI HISATOMI
Application Number:
JP27444288A
Publication Date:
May 10, 1990
Filing Date:
November 01, 1988
Export Citation:
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Assignee:
NORITAKE CO LTD
International Classes:
B23K35/22; H05K3/46; (IPC1-7): B23K35/22; H05K3/46
Attorney, Agent or Firm:
Tatsuo Ito (1 outside)