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Patent Searching and Data


Title:
CIRCUIT BOARD FOR SENSOR CHIP
Document Type and Number:
Japanese Patent JP2007067142
Kind Code:
A
Abstract:

To prevent the lifting of and the paste peeling in a sensor chip by a load applied to a circuit board when the sensor chip is fixed to the board, and wire bonding is carried out between the sensor chip and the circuit board.

This circuit board for the sensor chip has a diamond pattern 11 provided projecting from the surface of the board 1 on which the sensor chip ST is placed. A wire bonding holding projection 13 is provided in the portion surrounding the diamond pattern on the surface of the substrate 1 on the downside of the wire bonding terminal ST1 provided on the placed sensor chip ST.


Inventors:
TSUCHIYA MASAKI
Application Number:
JP2005000250736
Publication Date:
March 15, 2007
Filing Date:
August 31, 2005
Export Citation:
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Assignee:
SMK KK
International Classes:
H01L27/14; H01L21/52; H01L21/60; H01L31/02; H04N5/335
Attorney, Agent or Firm:
安原 正義
安原 正之