Title:
CIRCUIT CONNECTION MATERIAL, AND CONNECTION BODY FOR CIRCUIT MEMBER
Document Type and Number:
Japanese Patent JP2011233633
Kind Code:
A
Abstract:
To provide a circuit connection material achieving sufficiently low connection resistance even when used for connecting a circuit member having a narrowed electrode, and a connection body for a circuit member using the circuit connection material.
The circuit connection material contains: (A) a silica filler subjected to hydrophobic treatment and having an average particle diameter of 3-100 nm; (B) an adhesive component; and (C) conductive particles. An amount of the silica filler is 10-60 mass% or 5-30 vol.% relative to the total amount of the adhesive component.
Inventors:
NAGAHARA YUKO
ICHIMURA TAKEYUKI
TAKAI KENJI
ICHIMURA TAKEYUKI
TAKAI KENJI
Application Number:
JP2010101115A
Publication Date:
November 17, 2011
Filing Date:
April 26, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K1/14; C09J7/02; C09J11/04; C09J201/00; H05K3/32; H05K3/36
Domestic Patent References:
| JP2006196850A | 2006-07-27 | |||
| JP2000080341A | 2000-03-21 | |||
| JP2001064619A | 2001-03-13 | |||
| JP2000044892A | 2000-02-15 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hideki Okita
Yoshinori Shimizu
Hideki Okita
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