Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CIRCUIT CONNECTION MATERIAL, AND CONNECTION BODY FOR CIRCUIT MEMBER
Document Type and Number:
Japanese Patent JP2011233633
Kind Code:
A
Abstract:

To provide a circuit connection material achieving sufficiently low connection resistance even when used for connecting a circuit member having a narrowed electrode, and a connection body for a circuit member using the circuit connection material.

The circuit connection material contains: (A) a silica filler subjected to hydrophobic treatment and having an average particle diameter of 3-100 nm; (B) an adhesive component; and (C) conductive particles. An amount of the silica filler is 10-60 mass% or 5-30 vol.% relative to the total amount of the adhesive component.


Inventors:
NAGAHARA YUKO
ICHIMURA TAKEYUKI
TAKAI KENJI
Application Number:
JP2010101115A
Publication Date:
November 17, 2011
Filing Date:
April 26, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K1/14; C09J7/02; C09J11/04; C09J201/00; H05K3/32; H05K3/36
Domestic Patent References:
JP2006196850A2006-07-27
JP2000080341A2000-03-21
JP2001064619A2001-03-13
JP2000044892A2000-02-15
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hideki Okita