Title:
CLAD ARTICLE AND METHOD FOR FORMING CLAD ARTICLE
Document Type and Number:
Japanese Patent JP2019035139
Kind Code:
A
Abstract:
To provide a clad article (200) including an article (100) and a cladding layer (202).SOLUTION: The article (100) includes a surface layer (102), a cavity (104) disposed within the article (100) below the surface layer (102), and a microcrack (106) disposed in the surface layer (102). The surface layer (102) includes an HTW alloy (108). The cladding layer (202) is disposed on a surface (110) of the surface layer (102), and is formed from a PSP (204) brazed to the article (100). The cladding layer (202) is disposed over the microcrack (106). A method for forming the clad article (200) is disclosed including disposing the PSP (204) on the article (100) and brazing the PSP (204) to the article (100). Brazing the PSP (204) to the article (100) forms the cladding layer (202) disposed on the article (100) over the microcrack (106).SELECTED DRAWING: Figure 2
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| JPH02169239 | PREPARATION OF LAMINATED SINTERED BODY |
Inventors:
SRIKANTH CHANDRUDU KOTTILINGAM
TOLLISON BRIAN LEE
CUI YAN
TOLLISON BRIAN LEE
CUI YAN
Application Number:
JP2018066398A
Publication Date:
March 07, 2019
Filing Date:
March 30, 2018
Export Citation:
Assignee:
GENERAL ELECTRIC CO GE
International Classes:
B22F7/02; B22F3/105; B22F3/16; B33Y80/00; C22C19/03; C22C19/05; C22C19/07; F01D5/28; F02C7/00
Domestic Patent References:
| JP2014233759A | 2014-12-15 | |||
| JP2012236234A | 2012-12-06 | |||
| JP2015067902A | 2015-04-13 | |||
| JPH06501981A | 1994-03-03 | |||
| JP2002301589A | 2002-10-15 | |||
| JP2005214197A | 2005-08-11 |
Foreign References:
| US20080017694A1 | 2008-01-24 |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Takuto Tanaka
Hirokazu Ogura
Takuto Tanaka