To provide a cleaning apparatus and a cleaning method in which when a cleaning object (wafer) is cleaned, foreign substances are hard to be re-stuck to the surface of the cleaning object (wafer), and to provide a method for manufacturing a semiconductor device.
In the cleaning apparatus, an inner tub 11 and an outer tub 4 are arranged on two upper and lower layers and a cleaning object (wafer 1) is dipped into the inner tub 11 and cleaned while jetting a cleaning liquid 3 upward from the bottom 11a side of the inner tub 11. The bottom 11a of the inner tub 11 is formed like a mortar of which the center is depressed and cleaning liquid supply ports 12 jetting the cleaning liquid are formed on the circumferential side of the bottom 11a of the inner tub 11. Precipitable foreign substances 8 peeled off from the cleaning object are collected in the depressed center part of the bottom 11a, so that even when the cleaning liquid 3 is jetted, the foreign substances 8 are hard to be floated up and re-sticking of the foreign substances 8 to the cleaning object can be prevented.
YAMAGATA TAKAHIRO
KIKUCHI FUSAE
