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Patent Searching and Data


Title:
COATING APPARATUS FOR SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPH07263474
Kind Code:
A
Abstract:

PURPOSE: To coat only an end face of a wafer with polyimide resin of uniform thickness and to largely reduce a using amount of the resin.

CONSTITUTION: The coating apparatus for a semiconductor wafer comprises a chuck 35 for placing the wafer 12, chuck rotating means for rotating the chuck, coating means for forming polyimide resin films 51 of a predetermined thickness on surfaces of rotary rollers 42, 43 provided horizontally at the time of rotating the rollers, and aligning means for aligning a central mark of the wafer with a center of the chuck. The apparatus further comprises conveying means for placing the wafer on the chuck after aligning of the aligning means, and chuck moving means for so moving to fix the chuck that the oblique end face of the wafer 12 on the chuck is horizontally brought into contact with the film 51 on the surfaces of the rollers.


Inventors:
SATO MITSUO
YOSHIKAWA KIYOSHI
Application Number:
JP5040794A
Publication Date:
October 13, 1995
Filing Date:
March 22, 1994
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
B05C1/02; B05C11/08; H01L21/56; H01L23/29; H01L23/31; (IPC1-7): H01L21/56; B05C1/02; B05C11/08; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Hidekazu Miyoshi (3 outside)