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Patent Searching and Data


Title:
COATING METHOD OF PHOTORESIST
Document Type and Number:
Japanese Patent JPH0567861
Kind Code:
A
Abstract:

PURPOSE: To provide the coating method of photoresist in even thickness over the whole surface of a printed wiring in order to manufacture a printed-wiring circuit board.

CONSTITUTION: Within the coating method of photoresist using the dip process of boards, exceeding one cycle comprising the immersion, picking-up, drying-up and 180° turning step on the axis in the normal direction to the immersion direction is to be repeated.


Inventors:
SHIBAYAMA MITSUAKI
NAGANAMI TAKESHI
Application Number:
JP1991000252765
Publication Date:
March 19, 1993
Filing Date:
September 05, 1991
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO
International Classes:
B05C3/09; B05D1/18; H05K3/06; H05K3/18; (IPC1-7): B05C3/09; B05D1/18; H05K3/06; H05K3/18