COIL, AND HEATING MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Title:

COIL, AND HEATING MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Document Type and Number:

Japanese Patent JP2010118346

Kind Code:

A

Abstract:

To provide a coil which can be used for induction heating of a solder ball, and to provide a heating member and a semiconductor device using the same.

A device for packing a semiconductor chip is provided, and the package device has the coil for reflowing the solder ball of the semiconductor chip by induction heating. The coil 10301 has a first body 10320, a second body 10340 prepared in parallel with the first body 10320, and a third body 10360 extended from the first body 10320 to the second body 10340. The first body 10320 and the second body 10340 are prepared to be symmetrical to a vertical plane passing through between both main bodies. The first body 10320 and the second body 10340 have inclined planes wherein their faces facing each other get away from each other as positions of the faces go downward.

Inventors:

LEE KWANG-YONG
KIM MIN-ILL
LEE JONG-GI
HONG JI-SEOK
WOO HYUN JEONG

Application Number:

JP2009257601A

Publication Date:

May 27, 2010

Filing Date:

November 11, 2009

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD

International Classes:

H05B6/36; B23K1/00; B23K1/002; F27D11/06; H01L21/60; H05K3/34; B23K101/42

Domestic Patent References:

JPS57155694U	1982-09-30
JP2000260815A	2000-09-22
JP2005150142A	2005-06-09

Attorney, Agent or Firm:

Kyosei International Patent Office

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