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Title:
COMPACT HIGH-SPEED CONNECTOR
Document Type and Number:
Japanese Patent JP2020123578
Kind Code:
A
Abstract:
To minimize an input/output connector, capable of achieving a high data rate.SOLUTION: A connector system contains a plug assembly having a front connector mounded onto a circuit board. The connector has two wafers, and each wafer supports a row of terminals, and uses shims and pegs to precisely control the spatial relationship of the two wafers to the circuit board. Each wafer does not require to be directly contacted with the circuit board, and the terminals can contain tails. The tail part can be positioned on a slightly upper side of the circuit board, and can be connected to pads on the circuit board via solder connections. The connector system is optimized so as to enable a support of 25 Gbps data rates.SELECTED DRAWING: Figure 4B

Inventors:
BRANDON JANOWIAK
REGNIER KENT E
JERRY KACHLIC
Application Number:
JP2020068204A
Publication Date:
August 13, 2020
Filing Date:
April 06, 2020
Export Citation:
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Assignee:
MOLEX LLC
International Classes:
H01R13/6594; H01R13/652; H01R13/719; H01R24/60
Attorney, Agent or Firm:
Toshiaki Aoki
Kawai Makoto