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Patent Searching and Data


Title:
COMPOSITE METALLIZATION
Document Type and Number:
Japanese Patent JPH02279332
Kind Code:
A
Abstract:

PURPOSE: To enhance releasability and abrasion resistance by allowing a hard conductive film and a fluoroplastic film to coexist on the surface of a base metal in a flush state.

CONSTITUTION: A hard conductive film 2 and a fluoroplastic film 3 are allowed to coexist on the surface of a base metal 1 in a flush state. As the base metal, steel, stainless steel, copper or a copper alloy, aluminum or an aluminum alloy or the like can be used and the hard conductive film 2 is formed, for example, using a metal metal carbide, metal boride, metal nitride or an alloy thereof and pref. exposed to the surface of the base metal 1. The fluoroplastic film 3 is formed using a tetrafluoroethylene resin or a tetrafluoroethylene/ perfluoroalkoxy resin. By this method, a composite metallization having good releasability and high surface abrasion resistance and capable of preventing the charge of static electricity can be obtained.


Inventors:
NOMURA HIROTOSHI
OGUSHI SHIGEO
Application Number:
JP10141089A
Publication Date:
November 15, 1990
Filing Date:
April 20, 1989
Export Citation:
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Assignee:
NOMURA TECHNO RES KK
International Classes:
B32B15/082; B32B1/08; B32B7/02; B32B9/00; B32B15/08; (IPC1-7): B32B1/08; B32B7/02; B32B9/00; B32B15/08
Domestic Patent References:
JPS6020829U1985-02-13
JPS5516664U1980-02-01
JPS5195944A1976-08-23
Attorney, Agent or Firm:
Kurata Masahiko