Title:
COMPOSITION FOR BONDING CURABLE IMPRINTING COMPOSITION AND SUBSTRATE, AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2014003123
Kind Code:
A
Abstract:
To provide a composition for bonding a curable imprinting composition and a substrate, excellent in adhesion with a substrate and minimizing pattern defects.
A composition for bonding a curable imprinting composition and a substrate is a composition 2 for bonding, for improving adhesion between a substrate 1 and a curable imprinting composition film 3 in order to accurately reflect a pattern of a mold 4, and contains a compound having a molecular weight of 500 or more and a reactive group, while the content of a compound having a molecular weight of 200 or less is 10 mass% or less.
Inventors:
HATTORI AKIKO
KITAGAWA HIROTAKA
ENOMOTO YUICHIRO
KITAGAWA HIROTAKA
ENOMOTO YUICHIRO
Application Number:
JP2012136895A
Publication Date:
January 09, 2014
Filing Date:
June 18, 2012
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
H01L21/027; B29C59/02; C08F299/02; C08G12/32
Domestic Patent References:
| JP2011508680A | 2011-03-17 | |||
| JP2011168003A | 2011-09-01 | |||
| JP2011114180A | 2011-06-09 | |||
| JP2010045163A | 2010-02-25 |
Foreign References:
| WO2011021573A1 | 2011-02-24 |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes