Title:
COMPOSITION FOR FORMING SILICA LAYER, METHOD FOR MANUFACTURING SILICA LAYER, AND SILICA LAYER
Document Type and Number:
Japanese Patent JP2016216341
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a silica layer, a method for manufacturing a silica layer, and a silica layer manufactured thereby.SOLUTION: A composition for forming a silica layer includes a silicon-containing polymer and a solvent, where the silicon-containing polymer has a total sum of Si-H integral values in aH-NMR spectrum less than or equal to 12, where the total sum of the Si-H integral values is calculated under conditions described in the specification.SELECTED DRAWING: Figure 1
Inventors:
LEE EUN-SEON
KIM WOO-HAN
YUN HUI-CHAN
BAE JIN-HEE
HWANG BYEONG-GYU
KIM WOO-HAN
YUN HUI-CHAN
BAE JIN-HEE
HWANG BYEONG-GYU
Application Number:
JP2015230826A
Publication Date:
December 22, 2016
Filing Date:
November 26, 2015
Export Citation:
Assignee:
SAMSUNG SDI CO LTD
International Classes:
C01B33/12; H01L21/316
Attorney, Agent or Firm:
Hatta International Patent Corporation