Title:
CONDUCTIVE RESIN PASTE FOR SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH05120914
Kind Code:
A
Abstract:
PURPOSE: To provide paste, which is fine in productivity, is excellent in adhesiveness and moisture resistance, is small in the elastic modules of its cured staff, and is excellent in stress relaxation.
CONSTITUTION: A conductive resin paste contains, as main components, silver powder, bisphenol F, a subclinical amine compound, epoxy resin which is liquid at an ordinary temperature and hydrolyzing chlorine percentage content thereof is 500ppm or less, and a polybutadiene compound having an epoxy radical. Silver powder of 50-90 percentage by weight and polybutadiene compound of 0.1-7 percentage by weight having the epoxy radical are contained in the whole composition.
More Like This:
Inventors:
IMAI TSUTOMU
MIZUNO MASUO
MIZUNO MASUO
Application Number:
JP28448291A
Publication Date:
May 18, 1993
Filing Date:
October 30, 1991
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G59/56; C08G59/00; C08G59/62; C08L63/00; C09J9/02; C09J11/04; H01B1/22; H05K3/32; (IPC1-7): C08G59/56; C08G59/62; C08L63/00; C09J9/02; H01B1/22
Domestic Patent References:
| JPS601221A | 1985-01-07 | |||
| JPS601223A | 1985-01-07 | |||
| JPS5971380A | 1984-04-23 | |||
| JPS6369872A | 1988-03-29 |