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Patent Searching and Data


Title:
CONTACTLESS IC CARD AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2002298103
Kind Code:
A
Abstract:

To provide a low-cost IC card capable of corresponding with various modules and cards and a method for efficiently manufacturing the card thereof.

In this contactless IC card, an IC module 2, polyester hot-melt resin 6 and an over sheet 5 are sequentially loaded on at least a base material. The IC card is formed by laminating a multi-layer sheet previously laminating a polyester hot-melt resin layer with a melt viscosity of 50,000-150,000 CPS at 190°C and a thickness of 10-150 μm and an over-sheet layer by a co-extrusion technique and the base material on which the IC module is mounted. In manufacturing thereof, a surface of recording medium is smoothed by heat-pressing after laying the IC module and the co-extruded laminated sheet on the base material.


Inventors:
MORI HARUHIKO
Application Number:
JP2001097242A
Publication Date:
October 11, 2002
Filing Date:
March 29, 2001
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
B42D15/10; B29C47/02; B29C47/06; B29C65/02; G06K19/07; G06K19/077; H01L21/56; H01L23/29; H01L23/31; (IPC1-7): G06K19/07; B29C47/02; B29C47/06; B29C65/02; B42D15/10; G06K19/077; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
JPH11338990A1999-12-10
JPH11345298A1999-12-14