Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COOLING DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005009766
Kind Code:
A
Abstract:

To provide the structure of a cooling device and its manufacturing method, preventing deformation of a heat absorber and maintaining a predetermined heat radiating performance even when using a high pressure refrigerant by making the heat absorber in pressure resistance structure.

This cooling device is structured by face-joining the heat absorber 5 on the heat absorber heat exchanging main part 11 and the heat absorber lid 12 at a face-joining part 17 via flat plate type brazing material 13 by putting the heat absorber 5 into a high temperature furnace and brazing it.


Inventors:
ASHITANI HIROMASA
NAKANO MASAO
IKEDA AKIRA
Application Number:
JP2003174342A
Publication Date:
January 13, 2005
Filing Date:
June 19, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
F25D9/00; F28D15/02; H01L23/473; H05K7/20; (IPC1-7): F25D9/00; F28D15/02; H01L23/473; H05K7/20
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito