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Title:
COOLING DEVICE
Document Type and Number:
Japanese Patent JP2022184260
Kind Code:
A
Abstract:
To provide a cooling device capable of absorbing a difference in height between heating components having heights differing from each other without bending a board.SOLUTION: A cooling device comprises: a radiation fin 42 that covers a board 10; a radiation fin 41 that is supported by a support hole 43 formed in the radiation fin 42; a heating component 30 that is attached to the board 10 and connects with an undersurface of the radiation fin 42; and a heating component 20 that is attached to the board 10 and connects with an undersurface of the radiation fin 41.SELECTED DRAWING: Figure 1

Inventors:
OKINISHI YOSHIO
TAKAHASHI KEISUKE
KATO DAISUKE
TABUCHI HIROSHI
OTSUKA MASAYASU
OGAWA SHINGO
Application Number:
JP2021091993A
Publication Date:
December 13, 2022
Filing Date:
June 01, 2021
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K7/20; H01L23/36; H01L23/40
Attorney, Agent or Firm:
Patent Attorney Corporation Sanno Naigai Patent Office