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Title:
COPPER ALLOY SHEET EXCELLENT IN CONDUCTIVITY AND BENDING DEFLECTION COEFFICIENT
Document Type and Number:
Japanese Patent JP2017082335
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper alloy sheet having high strength, high conductivity, high bending deflection coefficient and excellent stress relaxation characteristic and an electronic component suitable for large current or heat release.SOLUTION: There is provided a copper alloy sheet containing one or more of Ni and Co of 0.8 to 5.0 mass%, Si of 0.2 to 1.5 mass% and the balance copper with inevitable impurities and having tensile strength of 500 MPa or more and A value provided by the following formula of 0.5 or more. A=2X+X-X, X=I/I, where Iand Iare diffraction integral strengths of a (hkl) surface calculated for a rolling surface and a copper powder by using an X-ray diffraction method respectively.SELECTED DRAWING: None

Inventors:
HATANO TAKAAKI
Application Number:
JP2016245733A
Publication Date:
May 18, 2017
Filing Date:
December 19, 2016
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; H01B1/02; H01B5/02
Domestic Patent References:
JP6223057B22017-11-01
Attorney, Agent or Firm:
アクシス国際特許業務法人



 
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