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Title:
COPPER ALLOY SHEET HAVING EXCELLENT HEAT DISSIPATION AND REPEATED BENDABILITY
Document Type and Number:
Japanese Patent JP2014080678
Kind Code:
A
Abstract:

To provide a copper alloy sheet as a heat dissipation part for a flexible printed circuit board, a liquid crystal frame and the like, having excellent heat dissipation, electro conductivity, repeated bendability and shape retainment.

Provided is a copper alloy sheet that contains Ag by 0 to 1.0 weight %, Ti by 0 to 0.08 weight %, Ni by 0 to 2.0 weight %, Zn by 0 to 3.5 weight %, and one or more of Cr, Fe, In, P, Si, Sn, and Zr by 0 to 0.5 weight % in total, and the remainder is composed of Cu and unavoidable impurities, in which the electric conductivity is 60% IACS or more, the tensile strength is 350 MPa or more, and regarding Euler angle (φ1, Φ, φ2), which is a set of angles at which ND, TD, RD of a material and [001], [010], [100] of a crystal coincide by rotating by φ1 with an ND axis as a rotation axis, followed by rotating by Φ in order to have the ND axis and a z axis to coincide, and finally rotating by φ2 around a [001] axis, the pole density of crystal orientation in Euler angle (40, 45, 0) is 18 or less.


Inventors:
KUROSAKI IKUYA
TAKAHASHI TOMOAKI
Application Number:
JP2013000192227
Publication Date:
May 08, 2014
Filing Date:
September 17, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C22C9/02; C22C9/00; C22C9/04; C22C9/06; C22C9/10; C22F1/08; H05K1/09; C22F1/00
Domestic Patent References:
JP2013166971A2013-08-29
JP2006089763A2006-04-06
JP5158915B22013-03-06
JP2010126783A2010-06-10
JP5158909B22013-03-06
JP2010248592A2010-11-04
Foreign References:
WO2012132713A12012-10-04
Attorney, Agent or Firm:
アクシス国際特許業務法人