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Title:
Cu-Co-Si BASED COPPER ALLOY ROLLED PLATE AND ELECTRIC COMPONENT USING THE SAME
Document Type and Number:
Japanese Patent JP2011252209
Kind Code:
A
Abstract:

To provide a Cu-Co-Si based copper alloy rolled plate excellent in press machining performance, bending machining performance and strength.

The Cu-Co-Si based copper alloy rolled plate contains 0.5 to 3.0 mass% of Co and 0.1 to 1.0 mass% of Si, and a residual part is composed of Cu and inevitable impurities. When a crystal orientation up to a 5 μm-depth from a plate surface is measured by an X ray diffraction method, the pole density of a sheared texture corresponding to a region of α=0 to 10° on a figure of a {111} positive pole point (here, α is an axis orthogonal to a rotation shaft of a diffracting goniometer defined in a Schultz method) is not lower than 1.5 and not higher than 8.


Inventors:
MAEDA NAOFUMI
Application Number:
JP2010000127432
Publication Date:
December 15, 2011
Filing Date:
June 03, 2010
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C22C9/06; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/10; H01B1/02; H01B5/02; C22F1/00; C22F1/08
Domestic Patent References:
JP2007092135A2007-04-12
JP2008106313A2008-05-08
JP2009185324A2009-08-20
JP2005179775A2005-07-07
JP2007092135A2007-04-12
JP2008106313A2008-05-08
JP2009185324A2009-08-20
JP2005179775A2005-07-07
Attorney, Agent or Firm:
赤尾 謙一郎
下田 昭