Title:
硬化性シリコーンゲル組成物及びシリコーンゲル硬化物
Document Type and Number:
Japanese Patent JP6947124
Kind Code:
B2
Abstract:
To provide a curable silicone gel composition having good fluidity, capable of curing at a comparatively low temperature, and giving a silicone gel cured product which is soft, and hard to be broken by shock.SOLUTION: The curable silicone gel composition includes: a linear organopolysiloxane (A) having one silicone atom-bonded vinyl group each at both molecular chain terminals; a three-dimensional network-structured organohydrogenpolysiloxane (B) having a (H(R)SiO) unit, and a SiOunit; a linear or branched chain organohydrogenpolysiloxane (C) having a SiH group only at a molecular terminal; an addition reaction catalyst (D); and a partially surface hydrophobic-treated aerosol silica (E) having a specific hydrophobic treatment degree, where a composition in which a blending mass of (B) is less than that of (C) is cured by addition reaction, and a penetration degree of the obtained cured product is 10-100 in terms of JIS K2220.SELECTED DRAWING: None
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Inventors:
Tadashi Araki
Shunsuke Igarashi
Shunsuke Igarashi
Application Number:
JP2018102933A
Publication Date:
October 13, 2021
Filing Date:
May 30, 2018
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/07; C08K9/06; C08L83/05
Domestic Patent References:
| JP2153969A | ||||
| JP57044659A | ||||
| JP2013076101A | ||||
| JP2003165906A | ||||
| JP2013082907A |
Attorney, Agent or Firm:
Hideaki International Patent Office