Title:
CURABLE RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2020105352
Kind Code:
A
Abstract:
To provide: a curable resin composition which can provide a cured material or a molded article having improved heat resistance, compatibility, dielectric characteristic, moist heat reliability, and thermal oxidative degradation resistance; a film obtained therefrom; a curable composite material; a laminate; and resin-coated copper foil.SOLUTION: The curable resin composition comprises: (A) a soluble polyfunctional vinyl aromatic copolymer containing a repeating unit (a) derived from a divinyl aromatic compound and a repeating unit (b) derived from a monovinyl aromatic compound; (B) a modified polyphenylene ether, at least a part of main chain terminals of which has a functional group other than a hydroxyl group, and (C) a phosphorus-containing fire retardant represented by the following formula (C1).SELECTED DRAWING: None
Inventors:
IWASHITA SHINICHI
KAWABE MASANAO
KAWABE MASANAO
Application Number:
JP2018245235A
Publication Date:
July 09, 2020
Filing Date:
December 27, 2018
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD
International Classes:
C08L25/00; B32B15/082; C08F212/34; C08J5/04; C08K3/013; C08K5/49; C08L71/12; H05K1/03
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse