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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2015209437
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition which is cured in a short time by heating and is excellent in storage stability.SOLUTION: The curable resin composition contains the following components (A) and (B): (A) a prepolymer which is obtained by reacting a polyisoprene polyol or a hydrogenated polyisoprene polyol (a-1) with a compound (a-2) having two or more isocyanate groups in one molecule and has an isocyanate group at a terminal thereof; and (B) a powder of a compound which is solid at normal temperature and has two or more primary amino groups or secondary amino groups in one molecule.

Inventors:
KIRINO MANABU
Application Number:
JP2014089561A
Publication Date:
November 24, 2015
Filing Date:
April 23, 2014
Export Citation:
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Assignee:
THREE BOND CO LTD
International Classes:
C08G18/10; C08G18/32