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Title:
CUSHIONING MATERIAL FOR WAFER PROTECTION
Document Type and Number:
Japanese Patent JP2019147573
Kind Code:
A
Abstract:
To provide a cushioning material for wafer protection which not only prevents intrusion of dust and dirt but is further excellent in flexibility.SOLUTION: A cushioning material for wafer protection consists of a foam sheet with resin films laminated on both sides. The compressive hardness of the cushioning material measured according to JIS-K6767 is equal to or less than 20N, and the open cell rate of the foam sheet is equal to or more than 75%.SELECTED DRAWING: Figure 1

Inventors:
NISHIJIMA MASATAKA
Application Number:
JP2018032369A
Publication Date:
September 05, 2019
Filing Date:
February 26, 2018
Export Citation:
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Assignee:
ACHILLES CORP
International Classes:
B65D81/05; B32B5/18; B32B27/00; C08J9/04
Attorney, Agent or Firm:
細井 勇
栗田 由貴子
佐藤 太亮



 
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