To provide a cutting device configured to optically detect a broken condition of a cutting blade, the cutting device accurately detecting the broken condition of the operating cutting blade.
The cutting device 1 includes a cutting blade 41 for cutting a semiconductor wafer W by rotation and a chuck table 13 for holding the semiconductor wafer W, wherein the cutting device is configured to perform cutting by relatively moving the cutting blade 41 and the chuck table 13 while supplying cutting water to the cutting blade 41. The cutting device further includes: a broken condition detection part 57 including a light-emitting element 62 and a light-receiving element 53 arranged opposed to each other across the cutting edge of the cutting blade 41, and detecting a broken condition of the cutting blade 41 based on the light-receiving quantity of the light-receiving element 63; and a cutting water supply part 56 which supplies detection auxiliary water to the opposed space between the light-emitting element 62 and the light-receiving element 63 so as to fill the opposed space with the detection auxiliary water.
| JP2008149388A | 2008-07-03 | |||
| JP2008262983A | 2008-10-30 | |||
| JP2004031415A | 2004-01-29 | |||
| JP2007012770A | 2007-01-18 |
Amada Masayuki
Yoshimasa Okada
Toru Kanno
Tsutomu Mizoguchi
Next Patent: PRINTED CIRCUIT BOARD FEED DEVICE AND METHOD OF FEEDING PRINTED CIRCUIT BOARDS