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Patent Searching and Data


Title:
CUTTING METHOD FOR CERAMICS COMPOUND PLATE
Document Type and Number:
Japanese Patent JPH04309461
Kind Code:
A
Abstract:

PURPOSE: To obtain the cutting method for a ceramics compound plate, which generates no cutting chips, nor necessitate holding force of a cutting device, and can execute cutting.

CONSTITUTION: On the reverse side of a ceramics compound plate 1, a conductive material 2 is provided along a cutting plane line. Cutting is executed by putting a high voltage electrode 5 from the surface of the plate 1, generating an arc between the plate and the conductive material 2, and simultaneously, injecting inflammable gas from a nozzle 4, and moving it along the cutting plane line.


Inventors:
TAKERA HIROSHI
Application Number:
JP1991000102094
Publication Date:
November 02, 1992
Filing Date:
April 05, 1991
Export Citation:
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Assignee:
KUBOTA KK
International Classes:
B23K9/013; B26F3/00; B28D1/22; (IPC1-7): B23K9/013; B26F3/00; B28D1/22