Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CUTTING METHOD OF WIRE SAW AND WIRE
Document Type and Number:
Japanese Patent JP2000233356
Kind Code:
A
Abstract:

To reduce undulation of a cutting face of a workpiece.

In a cutting method of a wire saw, a wire having one or more physical properties in the physical property that has a tensile strength of the wire 14 of 3200 to 4200 (N/mm2), the physical property that has average hardness of the wire 14 of 730 to 900 (Hv), the physical property showing that unevenness in hardness at one point at the center of a surface of an outer peripheral part of the wire 14 and a crossing face is within 2.0% according to standard deviation for average hardness, preferably, within 4% of dispersion, and the physical property showing that dispersion in hardness of the surface of the outer peripheral part is within 1.5% according to the standard deviation for average hardness, preferably, within 3% of dispersion is used, and a tensile force of the wire that is 1400 (N/mm2) or more and 2150 (N/mm2) or less by stress, preferably, 40 N or more and 55 N or less is applied to cut the wire. Consequently, a wear and an partial wear of the wire are reduced, a clearance between wire rows Cw is stabilized, and undulation and roughness of a water surface forming cutting face can be finished into a satisfactory condition.


Inventors:
YAMAMOTO SEIJI
SAWAFUJI SUSUMU
KISHIMOTO AKIRA
SHIRABE KOJIRO
KAWABE NOZOMI
HOSHIMA AKITO
Application Number:
JP1999000037216
Publication Date:
August 29, 2000
Filing Date:
February 16, 1999
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO SEIMITSU CO LTD
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B24B27/06; B28D5/04; (IPC1-7): B24B27/06; B28D5/04
Attorney, Agent or Firm:
Kenzo Matsuura



 
Previous Patent: SANDER

Next Patent: GROOVING DEVICE OF WORKPIECE BY WIRE SAW