Title:
CUTTING OBJECT INSPECTION DEVICE, CUTTING OBJECT INSPECTION METHOD, PROGRAM FOR CUTTING OBJECT INSPECTION DEVICE, AND CUTTING OBJECT INSPECTION SYSTEM
Document Type and Number:
Japanese Patent JP2013007741
Kind Code:
A
Abstract:
To provide a cutting object inspection device and the like capable of highly accurately inspecting cutting objects superposed in multiple stages.
The cutting object inspection device for inspecting cutting objects Bk superposed in multiple stages: obtains image data of the cutting objects on which predetermined-shape laser beams L1 and L2 are projected (S7); extracts images of parts on which the laser beams are projected from the image data and calculates information of the projected-shape laser beams from the extracted laser beam images (S8); and determines the propriety of the cutting objects superposed in multiple stages, on the basis of the predetermined-shape information and projection shape information (S11).
Inventors:
NUKUI HIROTADA
MATSUI HIDETO
MATSUI HIDETO
Application Number:
JP2012109200A
Publication Date:
January 10, 2013
Filing Date:
May 11, 2012
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
G01B11/25; B65H43/04; B65H43/08; G01N21/89
Domestic Patent References:
| JPH11132719A | 1999-05-21 | |||
| JPH1196378A | 1999-04-09 | |||
| JPH05262492A | 1993-10-12 | |||
| JP2008158933A | 2008-07-10 | |||
| JPH11132719A | 1999-05-21 |
Attorney, Agent or Firm:
Patent Business Corporation Intect International Patent Office
Yasuo Ishikawa
Kazuyuki Oku
Yasuo Ishikawa
Kazuyuki Oku