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Title:
CUTTING TOOL FOR RESIN FILM, AND CUTTING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2018187725
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting tool for a resin film, which can improve safety of work for cutting an end surface of a roll body of a resin film, by smoothly discharging swarf, and a cutting method using the same.SOLUTION: A cutting tool 1 cuts an end surface of a roll body of a resin film wound around a center axis, when the roll body is rotated on the center axis. The cutting tool 1 includes: a body part 11 for being attached to a tool rest; a cylindrical cutting edge part 12 that is arranged in the state of facing the end surface of the roll body; and a swarf guide part 13 that is formed like a hole on the inside of the cutting edge part 12 and that allows the passage of the swarf of the resin film, produced when the end surface of the roll body is cut.SELECTED DRAWING: Figure 1

Inventors:
SHIBATA TAKASHI
MATSUSHITA TSUTOMU
Application Number:
JP2017093106A
Publication Date:
November 29, 2018
Filing Date:
May 09, 2017
Export Citation:
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Assignee:
SHIROYAMA CO LTD
International Classes:
B23B27/00; B23B5/00; B23Q11/00
Domestic Patent References:
JP2001162581A2001-06-19
JPS5912504U1984-01-26
JPS57177602U1982-11-10
JPS6288542A1987-04-23
JPS6471644A1989-03-16
JP2008194777A2008-08-28
JP2010120156A2010-06-03
JP2010276888A2010-12-09
JP2013035103A2013-02-21
JP2003266214A2003-09-24
JP2002126903A2002-05-08
JP2006075962A2006-03-23
Foreign References:
US4515193A1985-05-07
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office