Title:
CUTTING TOOL, SKIVING PROCESSING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2019014037
Kind Code:
A
Abstract:
To reduce the surface roughness of a peripheral face of a work-piece cut by a skiving process.SOLUTION: A cutting tool according to the present disclosure has a cutting edge, a cutting face and a flank, and is used for cutting a surface of a work-piece through a skiving process in which the cutting edge is carried to the rotating columnar or cylindrical work-piece at an angle to the rotation axis of the work-piece. In addition, the cutting edge is formed such that when carried to the work-piece, the cutting edge comes into contract with the surface of the work-piece earlier than the cutting face. A radius passing through a flank-side end of a cutting face and a cutting-face-side end of the flank and inscribed in both the cutting face and the flank is 5 μm or less and the straightness of the cutting edge, expressed by a filtered waving curve, is 0.5 μm or less.SELECTED DRAWING: Figure 9
Inventors:
KOIDE YOSHIRO
KIMURA MASATAKA
KIMURA MASATAKA
Application Number:
JP2018200667A
Publication Date:
January 31, 2019
Filing Date:
October 25, 2018
Export Citation:
Assignee:
AISIN KIKO CO LTD
International Classes:
B23B27/00; B23B1/00
Domestic Patent References:
| JP2002263903A | 2002-09-17 | |||
| JP2010221351A | 2010-10-07 | |||
| JPS60207701A | 1985-10-19 | |||
| JPS63212401A | 1988-09-05 |
Foreign References:
| DE102007033767A1 | 2009-01-29 |
Attorney, Agent or Firm:
Aitec International Patent Office