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Patent Searching and Data


Title:
CVD SYSTEM
Document Type and Number:
Japanese Patent JPS6490521
Kind Code:
A
Abstract:

PURPOSE: To form a uniform film, by employing a specific structure in which a wafer holding body is disposed in a cylinder section for wafer holding body, and a rotation driving mechanism which rotates the wafer holding body is provided.

CONSTITUTION: A wafer 13 placed on a wafer holding body 12 is rotated at a constant rotating speed by a rotation driving mechanism as the wafer 13 is heated by an RF coil 20. Reaction gas is flowed from a gas inflow port 7 into a reaction tube main body 3 which is inclined to the horizontal plane, and guided smoothly on the wafer 13 placed on the holding body 12 by a reaction gas guiding member 14, thereby a predetermined film is formed on the upper surface of the wafer 13. The reacted gas is further flowed to the lower stream with respect to the holding body 12, and then ejected outward from a gas orifice 11 provided throughout a base 8. As a result, since the wafer 13 is rotated during the film formation, an uniform film is formed over the full upper surface of the wafer 13.


Inventors:
TAKAHASHI ICHIRO
Application Number:
JP1987000248573
Publication Date:
April 07, 1989
Filing Date:
September 30, 1987
Export Citation:
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Assignee:
DAIWA HANDOTAI SOCHI KK
International Classes:
H01L21/205; (IPC1-7): H01L21/205