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Title:
CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2023110977
Kind Code:
A
Abstract:
To provide a cyclic imide resin composition which gives a cured product having a low relative dielectric constant, a low dielectric loss tangent, high adhesive force and a high glass transition point.SOLUTION: A cyclic imide resin composition contains the following components (a) to (c). (a) Cyclic imide compound represented by the following formula (1). In the formula (1), A independently represents a tetravalent organic group including a cyclic structure, B independently represents a divalent hydrocarbon group, X represents a hydrogen atom or a methyl group, and m represents 1 to 1,000, (b) a compound having a molecular weight of less than 2,000 and at least two alkenyl groups in one molecule, in which (b1) 1-50 pts.mass of a compound having a dipolar moment calculated by Gaussian 16 of less than 1.2 DeBye, with respect to 100 pts.mass of the component (a), and (b2) 10 pts.mass or less of a compound having a dipolar moment calculated by Gaussian 16 of 1.2 DeBye or more, with respect to 100 pts.mass of the component (a), and (c) a curing catalyst.SELECTED DRAWING: None

Inventors:
IGUCHI HIROYUKI
TSUTSUMI YOSHIHIRO
YANAKA NAOKO
Application Number:
JP2022012543A
Publication Date:
August 10, 2023
Filing Date:
January 31, 2022
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
B32B15/08; C08F290/06; B32B15/088; C08G73/10; C08J5/18; C08J5/24; C09J179/08; H05K1/03
Attorney, Agent or Firm:
Patent Attorney Corporation Ushiki International Patent Office



 
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