Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DEVELOPING METHOD FOR WAFER
Document Type and Number:
Japanese Patent JPS62101028
Kind Code:
A
Abstract:

PURPOSE: To make a developer adhering on the surface of an exposed wafer flow on the surface of the wafer, to agitate the developer at the same time, to promote a developing reaction and to shorten the time required for development by attaching a fixed quantity of the developer onto the surface of the wafer and tilting the wafer from a horizontal surface intermittently or continuously under the state in which the wafer is not turned or is turned.

CONSTITUTION: An exposed wafer W being carried by a carrying means is sucked and fixed to a chuck 10. The surface of the wafer W is supplied with a fixed quantity of a developer, and the developer adheres on the surface of the wafer W by its own surface tension. The excess developer drops onto the inner surface of a funnel body 9, and is recovered from a drain hole not shown. A motor 2 starts its revolution, and the wafer W is rotated at extremely low speed. A motor 16 is also revolved together with the revolution of the motor 2, the motor 2 is oscillated periodically, and the wafer W is tilted before and behind. The speed of oscillation is set arbitrarily within a range that the developer adhering on the surface of the wafer W does not scatter. When development is completed, the revolution of the motor is stopped so that the motor 2 is returned to an erected attitude, and the developer adhering on the surface of the wafer W is removed, thus completing developing operation.


Inventors:
SATOU ATSUTOSHI
Application Number:
JP1985000240202
Publication Date:
May 11, 1987
Filing Date:
October 25, 1985
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ROHM CO LTD
International Classes:
G03F7/30; G03F7/00; G03F7/20; H01L21/027; H01L21/30; (IPC1-7): G03F7/00; H01L21/30
Domestic Patent References:
JPS5216172A1977-02-07