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Patent Searching and Data


Title:
DEVICE AND METHOD FOR DECIDING SUCTION HOLE POSITION
Document Type and Number:
Japanese Patent JP2002254226
Kind Code:
A
Abstract:

To shorten an amount of time needed for deciding a position of a suction hole to be formed in a backup board.

Machining data is prepared (S150), based on longitudinal and lateral lengths of a substrate 72 inputted at S100 and positional information on a machining-banned area stored in ROM beforehand (S140). With a substrate drilling machine doing this operation, an operator does not need to decide a position of the suction hole because the hole position is automatically decided based on the size of the substrate and the machining-banned area (a position of a substrate supporting part). As a result, the amount of time needed for forming the suction hole in the backup board is substantially shortened.


Inventors:
NAKAYAMA DAISUKE
Application Number:
JP2001000046812
Publication Date:
September 10, 2002
Filing Date:
February 22, 2001
Export Citation:
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Assignee:
BROTHER IND LTD
International Classes:
B23Q3/08; B23B41/00; B23B49/00; G05B19/4093; H05K3/00; (IPC1-7): B23B49/00; B23B41/00; B23Q3/08
Attorney, Agent or Firm:
足立 勉