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Patent Searching and Data


Title:
DEVICE AND METHOD FOR SUPPLYING CONDUCTIVE FLUID
Document Type and Number:
Japanese Patent JP2005054621
Kind Code:
A
Abstract:

To provide a device for supplying a conductive fluid capable of accurately transporting a very small amount of the conductive fluid, finely controlling the flow of the fluid, having high durability, and preventing a flow passage from being clogged even if oxides generate in the flow passage.

A pump comprises a pump chamber formed of a transportation surface and a housing covering the transportation surface and a plurality of electrodes disposed on the circumference of the pump chamber. By the electromagnetic inducting action by a rotating magnetic field, a circumferential flowing action is given to the conductive fluid filled in the pump chamber, and the circumferential flow of the conductive fluid is converted into the axial flow by a screw groove formed in the outer surface of the transportation surface or the inner surface of the housing.


Inventors:
MARUYAMA TERUO
SUETSUGU KENICHIRO
HIBINO TOSHIHARU
Application Number:
JP2003000284814
Publication Date:
March 03, 2005
Filing Date:
August 01, 2003
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
F04D3/02; F04D13/02; H02K44/06; (IPC1-7): F04D3/02; F04D13/02; H02K44/06
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito