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Patent Searching and Data


Title:
DEVICE PACKAGE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3215244
Kind Code:
B2
Abstract:

PURPOSE: To provide a device package that obtains the full functions of a device, and that prevents damage due to lead folding operation.
CONSTITUTION: A CCD package 20 holds a CCD 3 having a plurality of bumps 4 formed on its surface. Each bump 4 has a corresponding TAB lead 21 bonded thereto. The TAB leads 21 consist of a tape-shaped flexible substrate 22 of polyimide, and a plurality of belt-shaped copper foil bodies 23 formed on one side of the flexible substrate 22 by printing. The copper foil bodies 23 of the TAB leads 21 are electrically connected with the corresponding bumps 4. Each TAB lead 21 is folded, and a plurality of projected pieces 25 are formed thereon. The TAB leads 21 are folded perpendicularly to the CCD 3, the surface of which is covered with a glass cover 13.


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Inventors:
Aizawa, Toyoichi
Kazunari OI.
Sugiki, Tadashi
Shinozuka, Kenichi
Application Number:
JP1993000325343
Publication Date:
October 02, 2001
Filing Date:
December 22, 1993
Export Citation:
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Assignee:
TOSHIBA CORP
TOSHIBA AVE CORP
International Classes:
H01L21/60; H01L27/14; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
伊藤 進