PURPOSE: To reduce the cost of the title device by providing a fluid throttling device in an exhaust pipe to easily solidify and deposit the fluid at an optional position.
CONSTITUTION: A cylinder 8 as the fluid throttling means is closely attached to the inside of a round pipe 7 used as the exhaust pipe to solidify and deposit a by-product in the fluid generated in the main semiconductor producing device. As a result, the fluid from the left is throttled by the cylinder 8, and the flow velocity is increased, since the fluid after passing through the cylinder 8 is instantaneously expanded, a pressure difference is caused between the center of the pipe 7 and the inner periphery of the pipe 7, and a vortex is generated on the inner periphery of the pipe 7. The vortex is converged by the viscosity on the inner wall surface of the pipe 7, and a material 9 is solidified and deposited.