Title:
LAMINATE BOARD AND GLASS FABRIC FOR THE LAMINATE BOARD BASE MATERIAL AND METHOD OF USING THE LAMINATE BOARD
Document Type and Number:
Japanese Patent JP3116341
Kind Code:
B2
Abstract:
PURPOSE: To provide a laminate board adaptable to an insulation substrate of a a printed wiring board for mounting small parts having a good drilling property and a small coefficient of thermal expansion.
CONSTITUTION: The laminate board is formed by superimposing and heat-press molding glass woven fabric impregnated with thermosetting resin, wherein the warp and weft constituting glass woven fabric are made different in their glass composition, and the coefficient of thermal expansion in one of yarn is made lower than that of the other of yarn. For instance, the warp constituting the glass woven fabric is made into a glass composition with a coefficient of thermal expansion of 4ppm/°C or lower, and the weft is made into a yarn of E-glass. Prepreg obtained by impregnating and then drying thermosetting resin into the glass woven fabric is put on the glass woven fabric, and a copper foil is placed thereon for forming a copper plated laminate board through a heat-press molding operation.
Inventors:
Masayuki Noda
Minoru Yonekura
Hiroyuki Yamanaka
Minoru Yonekura
Hiroyuki Yamanaka
Application Number:
JP10178495A
Publication Date:
December 11, 2000
Filing Date:
April 26, 1995
Export Citation:
Assignee:
Shin-Kobe Electric Machinery Co., Ltd.
International Classes:
B32B5/08; B32B5/28; B32B15/08; B32B15/20; B32B17/04; H05K1/03; B32B5/04; (IPC1-7): B32B17/04; B32B5/04; B32B5/28; B32B15/08; B32B15/20; H05K1/03
Domestic Patent References:
| JP59109346A | ||||
| JP59109347A |