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Title:
DIP SOLDERING JIG AS WELL AS APPARATUS AND METHOD FOR DIP SOLDERING
Document Type and Number:
Japanese Patent JPH06268133
Kind Code:
A
Abstract:

PURPOSE: To provide a dip soldering jig wherein, in the soldering treatment of outer leads for a semiconductor integrated circuit device, it can reduce an irregularity in a soldering thickness, it can prevent a solder bridge from being caused and it can execute the soldering treatment of the outer leads on all sides in a singles soldering treatment.

CONSTITUTION: At least lowest face parts 3b of outer leads 3, for a housed semiconductor integrated circuit device 8, which are composed of a substance having a solder nonadhesive property are formed so as to come into contact with a dip soldering jig 1, and a solder dropping hole 4 is formed in such a way that an opening edge 4a comes into contact with the lowest face parts 3b of the outer leads 3.


Inventors:
SASAKI KAZUHIKO
Application Number:
JP5622393A
Publication Date:
September 22, 1994
Filing Date:
March 17, 1993
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C23C2/08; C23C2/10; C23C2/34; H01L23/50; (IPC1-7): H01L23/50; C23C2/08; C23C2/10; C23C2/34
Attorney, Agent or Firm:
Yamato Tsutsui



 
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