PURPOSE: To provide a dip soldering jig wherein, in the soldering treatment of outer leads for a semiconductor integrated circuit device, it can reduce an irregularity in a soldering thickness, it can prevent a solder bridge from being caused and it can execute the soldering treatment of the outer leads on all sides in a singles soldering treatment.

CONSTITUTION: At least lowest face parts 3b of outer leads 3, for a housed semiconductor integrated circuit device 8, which are composed of a substance having a solder nonadhesive property are formed so as to come into contact with a dip soldering jig 1, and a solder dropping hole 4 is formed in such a way that an opening edge 4a comes into contact with the lowest face parts 3b of the outer leads 3.