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Patent Searching and Data


Title:
DIRECT CURRENT CABLE
Document Type and Number:
Japanese Patent JPH09231839
Kind Code:
A
Abstract:

To suppress formation and accumulation of spatial electric changes and enhance the dielectric breakdown characteristic by furnishing an insulative substance layer which consists of synthesized polylefin or a bridged structure from it and whose moisture content lies under a specified level.

A DC cable concerned includes a conductor 1 consisting of copper strands. On this conductor 1, a semiconductive polyethylene composition is extruded as covering so that an internal semiconductive layer 2 is formed. The obtained semiconductive layer 2 is covered by an extrusion process with an insulative composition prepartred by mixing a bridging agent and age resistor with a polyethylene material synthesized through the action of metallocene catalyst, followed by a bridging process with heat so that an insulative substance layer 3 is formed. This layer 3 is covered by the extrusion process with a semiconductive polyethylene compound the same as used in the above-mentioned semiconductive layer 2 so that an external semiconductive layer 4 is formed, and further thereover a soft polyvinyl chloride resin is extruded as covering so that a sheath 5 is accomplished. After bridging, the insulative substance layer 3 is left on a vacuum so that its water content becomes under 10ppm.


Inventors:
OU SHINAN
AIDA FUMIO
Application Number:
JP3190696A
Publication Date:
September 05, 1997
Filing Date:
February 20, 1996
Export Citation:
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Assignee:
SHOWA ELECTRIC WIRE & CABLE CO
International Classes:
C08F4/64; C08F4/6592; C08F210/16; H01B3/44; H01B9/00; (IPC1-7): H01B9/00; C08F4/64; C08F210/16; H01B3/44
Attorney, Agent or Firm:
Suyama Saichi