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Title:
DISPERSION, METHOD FOR PRODUCING CONDUCTIVE PATTERN-EQUIPPED STRUCTURE BY USING DISPERSION, AND CONDUCTIVE PATTERN-EQUIPPED STRUCTURE
Document Type and Number:
Japanese Patent JP2021185269
Kind Code:
A
Abstract:
To form a conductive pattern having high dispersion stability and a low resistance over a board.SOLUTION: A dispersion (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersion is in a range of a following formula (2). 0.0001≤reductant mass/copper oxide mass≤0.10 (1). 0.0050≤dispersing agent mass/copper oxide mass≤0.30 (2). The dispersion containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.SELECTED DRAWING: Figure 8

Inventors:
ONO EIICHI
YUMOTO TORU
TSURUTA MASANORI
Application Number:
JP2021132447A
Publication Date:
December 09, 2021
Filing Date:
August 16, 2021
Export Citation:
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Assignee:
ASAHI KASEI CORP
International Classes:
B22F9/00; B22F1/00; B22F3/105; H01B13/00; H05K1/09; H05K3/12
Domestic Patent References:
JP2015008136A2015-01-15
Foreign References:
WO2015012264A12015-01-29
WO2004050559A12004-06-17
EP3127969A12017-02-08
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima