Title:
DOUBLE-SIDED PRINTED-CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH05283835
Kind Code:
A
Abstract:
PURPOSE: To realize a double-sided printed-circuit board consisting of a conductive layer and an insulative film, where conductive layers formed on both sides make a sure continuity with a small resistance value with a high adhesiveness of the insulative film and the conductive layers.
CONSTITUTION: A conduction path 4 filled with a metal substance is formed in the thickness direction of an insulative film 1, and a metal projection 3 at an end of the conduction path 4: this metal projection 3 is buried in the conductive layers 2 to make conductive contact. The insulative film 1 more improves adhesiveness by being formed of thermoplastic polyimide resin.
Inventors:
Shu Mochizuki
Maeda Masako
Kazuma Azuma
Maeda Masako
Kazuma Azuma
Application Number:
JP10928592A
Publication Date:
October 29, 1993
Filing Date:
April 01, 1992
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H05K1/11; (IPC1-7): H05K1/11
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